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The Business Brief FRIDAY, 21 AUGUST 2026
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DayOne Seeks Loan to Fund Hong Kong Data Center Ahead of US IPO

1 source ·1 article ·1h ago

DayOne Data Centers is seeking a HK$1.86 billion ($237 million) loan, according to people familiar with the matter, adding to the company’s recent borrowing spree ahead of a planned US initial public offering.

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Bloomberg 1

All coverage · 1 article

Bloomberg Markets ·1h ago

DayOne Seeks Loan to Fund Hong Kong Data Center Ahead of US IPO

DayOne Data Centers is seeking a HK$1.86 billion ($237 million) loan, according to people familiar with the matter, adding to the company’s recent borrowing spree ahead of a planned US initial public offering.